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| Material: | |
|---|---|
WYEM
WEIYUE
The chemical etching process works by laminating sheet metal with a light-sensitive photoresist which is exposed with UV-light to transfer the CAD image of the component. The areas of unexposed photoresist are removed (developed), then sprayed with etchant chemistry to accurately remove the unprotected material. The remaining photoresist is removed (stripped) to reveal the final etched component.
Holes as small as .01mm (see conditions)
Minimum hole size >= to 110% of metal thickness
Minimum ligature between holes >= to metal thickness
Almost any thin gauge metal bewteen 0.01mm – 1.5mm can be etched, including those considered hard to machine or ‘non-corrosive.’
Typical materials include:
Steel and stainless steels
Nickel and nickel alloys
Copper and copper alloys
Aluminium
Titanium and titanium alloys
Other specialist metals including molybdenum and polyimide metallised film
The chemical etching process works by laminating sheet metal with a light-sensitive photoresist which is exposed with UV-light to transfer the CAD image of the component. The areas of unexposed photoresist are removed (developed), then sprayed with etchant chemistry to accurately remove the unprotected material. The remaining photoresist is removed (stripped) to reveal the final etched component.
Holes as small as .01mm (see conditions)
Minimum hole size >= to 110% of metal thickness
Minimum ligature between holes >= to metal thickness
Almost any thin gauge metal bewteen 0.01mm – 1.5mm can be etched, including those considered hard to machine or ‘non-corrosive.’
Typical materials include:
Steel and stainless steels
Nickel and nickel alloys
Copper and copper alloys
Aluminium
Titanium and titanium alloys
Other specialist metals including molybdenum and polyimide metallised film
